The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Jul. 16, 2018
Applicant:
Asm Technology Singapore Pte Ltd, Singapore, SG;
Inventors:
Assignee:
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/00 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01); B23K 3/06 (2006.01); B23K 101/32 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 3/063 (2013.01); B23K 20/005 (2013.01); B23K 2101/32 (2018.08); H01L 2224/78611 (2013.01);
Abstract
A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.