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Hong Kong, China

A-Sat Corporation

USPTO Granted Patents = 69

% Expired Patents = 8.7

EPO Patents = 1

Forward Citations = 6,503

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52 inventors (with patents filed for the assignee):

Chun Ho Fan (40 out of 51 patents)

Neil McLellan (25 out of 31 patents)

Kwok Cheung Tsang (18 out of 23 patents)

4. Mohan Kirloskar (15 out of 19 patents)

5. Kin Pui Kwan (15 out of 18 patents)

6. Wing Him Lau (14 out of 16 patents)

7. Edward G Combs (10 out of 10 patents)

8. Ming Wang Sze (7 out of 9 patents)

9. Sadak Thamby Labeeb (5 out of 5 patents)

10. Robert P Sheppard (5 out of 5 patents)

11. Neil Robert McLellan (5 out of 5 patents)

12. Neil Mclellan (5 out of 5 patents)

13. Wing Keung Lam (4 out of 6 patents)

14. Tsui Yee Lin (4 out of 4 patents)

15. William Lap Keung Chow (4 out of 4 patents)

Core Competencies:

Integrated Circuit Package

Ball Grid Array

Leadless Plastic Chip Carrier

Thermal Dissipation

Thin Array Plastic Package

Shielded Package

Molded Plastic Package

Stacked Semiconductor Package

Die Attach Pad

Flexible Package

Electrical Performance

High Power Dissipation

69 patents: Sort by Forward Citations

1. 10679828 - Method of measuring gas introducing hole provided in electrode for plasma etching device, electrode, electrode regeneration method, regenerated electrode, plasma etching device, and gas introducing hole state distribution diagram and display method for same (2020-06-09),

2. 7482690 - Electronic components such as thin array plastic packages and process for fabricating same (2009-01-27),

3. 7449771 - Multiple leadframe laminated IC package (2008-11-11),

4. 7439099 - Thin ball grid array package (2008-10-21),

5. 7411289 - Integrated circuit package with partially exposed contact pads and process for fabricating the same (2008-08-12),

6. 7410830 - Leadless plastic chip carrier and method of fabricating same (2008-08-12),

7. 7381588 - Shielded integrated circuit package (2008-06-03),

8. 7372151 - Ball grid array package and process for manufacturing same (2008-05-13),

9. 7371610 - Process for fabricating an integrated circuit package with reduced mold warping (2008-05-13),

10. 7358119 - Thin array plastic package without die attach pad and process for fabricating the same (2008-04-15),

11. 7348663 - Integrated circuit package and method for fabricating same (2008-03-25),

12. 7344920 - Integrated circuit package and method for fabricating same (2008-03-18),

13. 7342305 - Thermally enhanced cavity-down integrated circuit package (2008-03-11),

14. 7315080 - Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader (2008-01-01),

15. 7271032 - Leadless plastic chip carrier with etch back pad singulation (2007-09-18),

Company Overview

A-Sat Corporation, based in Hong Kong, specializes in integrated circuit packaging solutions. The company focuses on developing advanced packaging technologies such as Ball Grid Array, Leadless Plastic Chip Carrier, and various molded and shielded packages. A-Sat is dedicated to enhancing thermal dissipation and optimizing design for stacked semiconductor packages, catering to the evolving needs of the electronics industry. Their expertise positions them as a key player in the integrated circuit packaging sector, addressing the demands of modern electronic applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

69 Patents

#44 in Hong Kong

#480 in China

#10,773 in the World

Hong Kong, China

A-Sat Corporation

Forward Citations = 6,503

52 inventors:

Chun Ho Fan (40 out of 51 patents)

Neil McLellan (25 out of 31 patents)

Kwok Cheung Tsang (18 out of 23 patents)

4. Mohan Kirloskar (15 out of 19 patents)

5. Kin Pui Kwan (15 out of 18 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: A-Sat Corporation. Retrieved from https://idiyas.com/company/a-sat

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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