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For the Inventor, By the Inventor

Cupertino, CA, United States of America

Mohan Kirloskar

This inventor holds 19 USPTO granted patents. Top assignees: A-Sat Corporation, Shinko Electric Industries Co., Ltd., Lsi Logic Corporation. Active years: 2001-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mohan Kirloskar. Retrieved from https://idiyas.com/inventor/mohan-kirloskar

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19

% Patents Active = 84.2

Average Co-Inventor Count = 3.1

ph-index = 14

Forward Citations = 1,007(Granted Patents)


Company Filing History:

goldMedal15 out of 69 
 
A-Sat Corporation
 patents
silverMedal2 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents
bronzeMedal1 out of 3,715 
 
Lsi Logic Corporation
 patents
4. 1 out of 834,513 
Other
 patents

Years Active: 2001-2010

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19 patents (USPTO):Explore Patents
1. 7732914 - Cavity-type integrated circuit package (2010-06-08),
2. 7411289 - Integrated circuit package with partially exposed contact pads and process for fabricating the same (2008-08-12),
3. 7381588 - Shielded integrated circuit package (2008-06-03),
4. 7371610 - Process for fabricating an integrated circuit package with reduced mold warping (2008-05-13),
5. 7348663 - Integrated circuit package and method for fabricating same (2008-03-25),
6. 7344920 - Integrated circuit package and method for fabricating same (2008-03-18),
7. 7342305 - Thermally enhanced cavity-down integrated circuit package (2008-03-11),
8. 7315080 - Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader (2008-01-01),
9. 7091581 - Integrated circuit package and process for fabricating the same (2006-08-15),
10. 7081403 - Thin leadless plastic chip carrier (2006-07-25),
11. 7071545 - Shielded integrated circuit package (2006-07-04),
12. 7033517 - Method of fabricating a leadless plastic chip carrier (2006-04-25),
13. 7009286 - Thin leadless plastic chip carrier (2006-03-07),
14. 6987032 - Ball grid array package and process for manufacturing same (2006-01-17),
15. 6984785 - Thermally enhanced cavity-down integrated circuit package (2006-01-10),

Title: Mohan Kirloskar - Pioneering Inventor from Cupertino

Introduction: Mohan Kirloskar is a renowned inventor based in Cupertino, CA, known for his groundbreaking contributions to the field of engineering and technology.

Latest Patents: Mohan Kirloskar holds several patents in the areas of mechanical engineering, renewable energy, and sustainable technologies, with his most recent patent focusing on innovative water purification systems.

Career Highlights: With a career spanning over three decades, Mohan Kirloskar has worked with leading research institutions and companies to develop cutting-edge solutions in the fields of automotive engineering, aerospace, and environmental sustainability.

Collaborations: Throughout his career, Mohan Kirloskar has collaborated with top universities, multinational corporations, and government agencies to bring his inventions to life, showcasing his ability to work across diverse sectors and disciplines.

Conclusion: Mohan Kirloskar's passion for innovation and his dedication to creating a positive impact on society through his inventions have solidified his reputation as a visionary inventor in the tech hub of Cupertino, CA.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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