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For the Inventor, By the Inventor

Nagano, Japan

Shinko Electric Industries Co., Ltd.


USPTO Granted Patents = 1,700



Trademarks = 2

Forward Citations = 10,836

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723 inventors (with patents filed for the assignee):

goldMedal Mitsutoshi Higashi (130 out of 132 patents)

silverMedal Kei Murayama (120 out of 121 patents)

bronzeMedal Masahiro Sunohara (109 out of 111 patents)

4.  Michio Horiuchi (91 out of 93 patents)

5.  Hideaki Sakaguchi (82 out of 82 patents)

6.  Yoshihiro Machida (67 out of 67 patents)

7.  Akinori Shiraishi (65 out of 66 patents)

8.  Noriyoshi Shimizu (59 out of 59 patents)

9.  Takaharu Yamano (57 out of 57 patents)

10.  Akio Rokugawa (55 out of 56 patents)

11.  Yuichi Taguchi (43 out of 47 patents)

12.  Naoyuki Koizumi (41 out of 41 patents)

13.  Katsuya Fukase (40 out of 41 patents)

14.  Kentaro Kaneko (40 out of 40 patents)

15.  Junichi Nakamura (39 out of 50 patents)


Core Competencies:
Electrostatic Chuck
Wiring Board
Substrate Fixing Device
Laminated Wiring Board
Interconnect Substrate
Semiconductor Apparatus
Embedded Printed Circuit Board
Optical Waveguide
Heat Pipe
Sensor Module
Ceramic Substrate
Component-Containing Substrate

1,700 patents:

1. 12513829 - Wiring board, semiconductor device, and wiring board manufacturing method (2025-12-30),
2. 12506064 - Semiconductor device (2025-12-23),
3. 12506063 - Semiconductor device including semiconductor elements, insulating base members, wirings, and wiring members (2025-12-23),
4. 12506042 - Header for semiconductor package (2025-12-23),
5. 12501544 - Wiring substrate (2025-12-16),
6. 12498180 - Heat pipe (2025-12-16),
7. 12488966 - Substrate fixing device (2025-12-02),
8. 12482734 - Laminated wiring board (2025-11-25),
9. 12482691 - Substrate fixing device (2025-11-25),
10. 12482689 - Electrostatic chuck (2025-11-25),
11. 12463131 - Interconnect substrate with layers constituting stripline and semiconductor apparatus (2025-11-04),
12. 12463101 - Wiring board assembly, wiring board, and wiring board manufacturing method (2025-11-04),
13. 12459227 - Substrate (2025-11-04),
14. 12451631 - Interconnect substrate including substrates and connector disposed in recess (2025-10-21),
15. 12438074 - Semiconductor apparatus (2025-10-07),
Shinko Electric Industries Co., Ltd. is a Japanese company that specializes in the manufacture and sale of semiconductor equipment, including packaging materials and machinery. With a history dating back to 1946, Shinko Electric Industries has become a leading supplier of advanced technology solutions for the semiconductor industry. The company's commitment to innovation, quality, and customer satisfaction has made it a trusted partner for many global semiconductor companies.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 6 2026

1,700 Patents

#1 in Nagano

#135 in Japan

#581 in the World

...
Nagano, Japan

Shinko Electric Industries Co., Ltd.

Forward Citations = 10,836

723 inventors:

goldMedal Mitsutoshi Higashi (130 out of 132 patents)

silverMedal Kei Murayama (120 out of 121 patents)

bronzeMedal Masahiro Sunohara (109 out of 111 patents)

4.  Michio Horiuchi (91 out of 93 patents)

5.  Hideaki Sakaguchi (82 out of 82 patents)

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