The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Jan. 27, 2023
Shinko Electric Industries Co., Ltd., Nagano, JP;
Atsuto Yoda, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
An interconnect substrate includes a first interconnect substrate having a first electrode on a first surface and having a recess formed in an edge in a plan view normal to the first surface, a second interconnect substrate having a second electrode on a second surface facing toward the first surface, a connector disposed inside the recess and electrically connected to the first interconnect substrate, an intermediate substrate disposed between the first interconnect substrate and the second interconnect substrate, the intermediate substrate including an insulating base and a conductive via, the insulating base having a through hole extending from a third surface facing the first surface to a fourth surface facing the second surface, the conductive via being disposed in the through hole, a first conductive member electrically connecting the first electrode and the conductive via, and a second conductive member electrically connecting the second electrode and the conductive via.