The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Jun. 27, 2022
Shinko Electric Industries Co., Ltd., Nagano, JP;
Shinichiro Sekijima, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor apparatus includes a first substrate having a first major surface and a plurality of first conductive pads on the first major surface, a second substrate having a second major surface opposing the first major surface, and having a plurality of second conductive pads on the second major surface, a semiconductor device disposed between the first substrate and the second substrate and mounted on the first major surface of the first substrate, and a plurality of bonding members that bond the first conductive pads and the second conductive pads together, wherein in a plan view normal to the first major surface, the first substrate has a rectangular plane shape with a first side and a second side each extending parallel to a first direction, and a third side and a fourth side each extending parallel to a second direction perpendicular to the first direction.