The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Oct. 24, 2022
Shinko Electric Industries Co., Ltd., Nagano, JP;
Takashi Nakajima, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
An interconnect substrate includes a first interconnect layer, a first insulating layer covering a side surface and a lower surface of the first interconnect layer, a second insulating layer disposed on the first insulating layer and covering an upper surface of the first interconnect layer, a second interconnect layer formed on a lower surface of the first insulating layer, and a third interconnect layer formed on an upper surface of the second insulating layer, wherein the second interconnect layer includes a first ground plane, wherein the third interconnect layer includes a second ground plane, and wherein the first ground plane, the first insulating layer, the first interconnect layer, the second insulating layer, and the second ground plane constitute a stripline.