This inventor holds 61 USPTO granted patents and 4 published patent applications, primarily in Wiring Substrate Technology (CPC class H01L). Top assignees: Shinko Electric Industries Co., Ltd., Shinko Electric Industries Inc., Ltd.. Active years: 2004-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
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59 out of 1,704 
2 out of 42 Years Active: 2004-2026
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Title: An Insight into the Innovations of Noriyoshi Shimizu
Introduction: Noriyoshi Shimizu is a prominent inventor based in Nagano, Japan, known for his significant contributions to the field of electronics and materials engineering. With a remarkable portfolio that includes 58 patents, Shimizu has made a notable impact in the development of advanced interconnect substrates and wiring boards.
Latest Patents: Shimizu's recent patents exemplify his innovative prowess in electronic materials. One of his latest innovations is the patent for an interconnect substrate, which entails a core layer made of a non-photosensitive thermosetting resin, featuring a through interconnect that enhances electronic connectivity. This substrate is designed with varying layers of interconnect structures that ensure efficient electrical connections while incorporating enhanced rigidity.
Another notable invention is his wiring board, which includes a thin film capacitor and an interconnect layer that is intricately connected to the capacitor. This inventive design employs a non-photosensitive thermosetting resin encapsulating the components, providing effective protection and functionality in electronic applications.
Career Highlights: Shimizu has built his career at Shinko Electric Industries Co., Ltd., a company renowned for its innovations in semiconductor packaging and circuit board manufacturing. His work at Shinko has allowed him to lead groundbreaking projects that push the boundaries of electronic engineering.
Collaborations: Throughout his career, Shimizu has collaborated with esteemed colleagues such as Akio Rokugawa and Wataru Kaneda. These collaborations have fostered an environment of innovation that has been instrumental in producing advancements in the field.
Conclusion: Noriyoshi Shimizu's contributions to the development of interconnect substrates and wiring boards highlight his pivotal role as an inventor in the electronics industry. With 58 patents to his name, Shimizu continues to inspire future innovations that enhance electronic technologies. His work showcases the importance of collaboration in driving advancements and improving industry standards.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile