The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Jun. 05, 2024
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Takashi Nishiyama, Nagano, JP;

Tomoo Yamasaki, Nagano, JP;

Noriyoshi Shimizu, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01);
Abstract

A wiring board includes a first insulating layer provided on an interconnect layer, a second insulating layer provided on the first insulating layer, a first opening formed in the first insulating layer and reaching the interconnect layer, a second opening formed in the second insulating layer and having a lower end connected to an upper end of the first opening, a third opening formed in the second insulating layer and having a lower end connected to an upper end of the second opening, and a connection terminal formed inside the first, second, and the third openings, and making contact with an upper surface of the interconnect layer. The lower end diameter of the second opening is equal to the upper end diameter of the first opening, and the lower end diameter of the third opening is larger than the upper end diameter of the second opening.


Find Patent Forward Citations

Loading…