Nagano, Japan

Takashi Nishiyama

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Shinko Electric Industries Inc., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Nishiyama. Retrieved from https://idiyas.com/inventor/takashi-nishiyama-m2zu7klt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Takashi Nishiyama: Wiring Board Inventor

Introduction

Takashi Nishiyama is an inventor associated with Nagano, Japan, and Shinko Electric Industries, Ltd. His work includes a patented wiring-board design focused on the structure connecting a terminal to an interconnect layer.

Latest Patents

Nishiyama is credited with 1 patent, titled “Wiring board.” The invention describes a wiring board with three connected openings formed across two insulating layers. A connection terminal sits within the openings and contacts the upper surface of the interconnect layer. The opening dimensions are arranged so that the lower end of the second opening matches the upper end of the first, while the lower end of the third opening is wider than the upper end of the second.

Career Highlights

Nishiyama’s listed patent reflects work on wiring-board construction and the connection between board terminals and interconnect layers. He is associated with Shinko Electric Industries, Ltd.

Collaborations

Nishiyama’s listed coworkers include Tomoo Yamasaki and Noriyoshi Shimizu.

Conclusion

Takashi Nishiyama’s patent documents a wiring-board design that uses connected openings and a terminal contacting an interconnect layer, highlighting his contribution to electronic interconnection technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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