The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Feb. 24, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Kosuke Tsukamoto, Nagano, JP;

Noriyoshi Shimizu, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/17 (2013.01); H01L 25/0655 (2013.01); H01L 24/81 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16168 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/15787 (2013.01);
Abstract

A wiring board includes: a first insulating layer; a first wiring layer formed on a lower surface of the first insulating layer; a first through hole which penetrates the first insulating layer; a first via wiring including: a filling portion formed to fill the first through hole; and a protruding portion protruding upward from an upper surface of the first insulating layer; a second wiring layer including a land, wherein the land includes an outer circumferential portion and a central portion, a second insulating layer formed on the upper surface of the first insulating layer; a second through hole which penetrates the second insulating layer in the thickness direction; a second via wiring formed to fill the second through hole; and a third wiring layer formed on an upper surface of the second insulating layer.


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