Kosuke Tsukamoto

Title: Innovations by Kosuke Tsukamoto

Introduction

Kosuke Tsukamoto is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative approach to wiring substrates and devices.

Latest Patents

Tsukamoto's latest patents include a wiring substrate and a semiconductor device. The wiring substrate features a first insulating layer with a first through-hole, a wiring layer on its lower surface, and a via wiring that connects to the wiring layer. This via wiring is designed to gradually become thinner from one side to the other, incorporating a first recess at its upper end, which serves as an electrode pad for electric connection with electronic components. His second patent, a wiring board and semiconductor device, includes a first insulating layer, a first wiring layer, and a first through hole. It also features a second wiring layer with a land that has both an outer circumferential portion and a central portion, along with a second insulating layer and a second through hole.

Career Highlights

Kosuke Tsukamoto is currently employed at Shinko Electric Industries Co., Ltd., where he continues to develop innovative solutions in the semiconductor industry. His work has been instrumental in advancing the technology used in wiring substrates and devices.

Collaborations

Tsukamoto collaborates with Noriyoshi Shimizu, contributing to the development of cutting-edge technologies in their field.

Conclusion

Kosuke Tsukamoto's contributions to semiconductor technology through his patents reflect his innovative spirit and dedication to advancing the industry. His work at Shinko Electric Industries Co., Ltd. continues to influence the future of electronic components.