The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Jun. 20, 2017
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Kosuke Tsukamoto, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;
Abstract
A wiring substrate includes a first insulating layer including a first through-hole formed through the first insulating layer in a thickness direction, a wiring layer formed on a lower surface of the first insulating layer, and a via wiring filled in the first through-hole and connected to the wiring layer, the via wiring having such a shape that it gradually becomes thinner from one side close to the lower surface of the first insulating layer toward the other side close to an upper surface of the first insulating layer, the via wiring including a first recess formed in an upper end surface of the via wiring. An upper end portion of the via wiring is an electrode pad for electric connection with an electronic component.