The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Apr. 26, 2022
Shinko Electric Industries Co., Ltd., Nagano, JP;
Hiroshi Taneda, Nagano, JP;
Noriyoshi Shimizu, Nagano, JP;
Rie Mizutani, Nagano, JP;
Masaya Takizawa, Nagano, JP;
Yoshiki Akiyama, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO.. LTD., Nagano, JP;
Abstract
A wiring board includes an insulating layer, a thin film capacitor laminated on the insulating layer, an interconnect layer electrically connected to the thin film capacitor, and an encapsulating resin layer laminated on the thin film capacitor. The interconnect layer includes a pad protruding from the thin film capacitor. The encapsulating resin layer is a mold resin having a non-photosensitive thermosetting resin as a main component thereof. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad.