Nagano, Japan

Hiroshi Taneda

USPTO Granted Patents = 8 

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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8 patents (USPTO):

Title: Innovations of Hiroshi Taneda

Introduction

Hiroshi Taneda is a prominent inventor based in Nagano, Japan. He has made significant contributions to the field of electronics, particularly in the development of advanced wiring boards and semiconductor devices. With a total of eight patents to his name, Taneda's work has had a considerable impact on the industry.

Latest Patents

Taneda's latest patents include a wiring board and semiconductor device that feature a non-photosensitive thermosetting encapsulating layer over a photosensitive resin layer of the interconnect structure. This innovative wiring board comprises an interconnect structure with multiple interconnect layers and insulating layers, where the encapsulating resin layer is designed to protect the interconnects while allowing for efficient semiconductor chip mounting. Another notable patent involves a wiring substrate that includes a bendable portion with alternately stacked wiring and insulation layers. This design enhances flexibility and durability, making it suitable for various applications.

Career Highlights

Hiroshi Taneda has spent a significant portion of his career at Shinko Electric Industries Co., Ltd., where he has been instrumental in advancing the company's technological capabilities. His expertise in wiring boards and semiconductor devices has positioned him as a key figure in the field.

Collaborations

Throughout his career, Taneda has collaborated with notable colleagues, including Noriyoshi Shimizu and Yoshiki Akiyama. These partnerships have fostered innovation and contributed to the successful development of various projects.

Conclusion

Hiroshi Taneda's contributions to the field of electronics through his patents and collaborations highlight his role as a leading inventor. His work continues to influence the industry and pave the way for future innovations.

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