The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Mar. 20, 2015
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Noriyoshi Shimizu, Nagano, JP;

Wataru Kaneda, Nagano, JP;

Akio Rokugawa, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 3/26 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/46 (2006.01); H01L 25/10 (2006.01); H01L 23/15 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49827 (2013.01); H01L 25/105 (2013.01); H05K 3/4673 (2013.01); H01L 23/145 (2013.01); H01L 23/15 (2013.01); H01L 23/49811 (2013.01); H01L 23/49894 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/0655 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H05K 1/0222 (2013.01); H05K 1/0225 (2013.01); H05K 1/0298 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 1/116 (2013.01); H05K 3/26 (2013.01); H05K 3/381 (2013.01); H05K 3/4676 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0281 (2013.01); H05K 2201/0293 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/068 (2013.01); H05K 2201/093 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09681 (2013.01); H05K 2203/0514 (2013.01);
Abstract

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.


Find Patent Forward Citations

Loading…