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Poughkeepsie, NY, United States of America

Thomas Weiss

This inventor holds 88 USPTO granted patents and 2 published patent applications, primarily in Electronic Packaging (CPC class H05K5-0208). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Gt Beverages, LLC. Active years: 1999-2026.

USPTO Granted Patents = 88 (Patent Applications = 2)

% Patents Active = 56.8

Average Co-Inventor Count = 4.2

ph-index = 14

Forward Citations = 718(Granted Patents)

Forward Citations (Not Self Cited) = 654(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Orange, CA (US) (1999)
Laguna Niguel, CA (US) (2000)
Poughquag, NY (US) (2000 - 2002)
Corona, CA (US) (2003 - 2006)
Lake Forest, CA (US) (2008)
Ladera Ranch, CA (US) (2009)
Poughkeepsie, NY (US) (2003 - 2022)

Company Filing History:

75 out of 166,159

International Business Machines Corporation

International Business Corporation

patents

5. 4 out of 834,307

Other

patents

where one patent can have more than one assignee

Years Active: 1999-2026

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Areas of Expertise:

Die-to-Die Communication

Thermal Management

Chip Bonding

Tamper-Respondent Assemblies

Integrated Circuits

Organic Laminate Substrates

Copper Block

Electronic Packages

Multi-Chip Carriers

Lead-Free Solder

Precision Alignment

Heat Sinks

88 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12690412 - Verifying alignment of multiple die on a substrate (2026-07-21),

2. 11521952 - Spacer for die-to-die communication in an integrated circuit and method for fabricating the same (2022-12-06),

3. 11393759 - Alignment carrier for interconnect bridge assembly (2022-07-19),

4. 11302651 - Laminated stiffener to control the warpage of electronic chip carriers (2022-04-12),

5. 11282773 - Enlarged conductive pad structures for enhanced chip bond assembly yield (2022-03-22),

6. 11239183 - Mitigating thermal-mechanical strain and warpage of an organic laminate substrate (2022-02-01),

7. 11235404 - Personalized copper block for selective solder removal (2022-02-01),

8. 11228124 - Connecting a component to a substrate by adhesion to an oxidized solder surface (2022-01-18),

9. 11168400 - Formation of terminal metallurgy on laminates and boards (2021-11-09),

10. 11031373 - Spacer for die-to-die communication in an integrated circuit (2021-06-08),

11. 10957650 - Bridge support structure (2021-03-23),

12. 10950573 - Lead-free column interconnect (2021-03-16),

13. 10916507 - Multiple chip carrier for bridge assembly (2021-02-09),

14. 10892249 - Carrier and integrated memory (2021-01-12),

15. 10840214 - Carrier and integrated memory (2020-11-17),

Title: The Innovative Journey of Thomas Weiss

Introduction: Thomas Weiss, a pioneering inventor based in Poughkeepsie, NY, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Thomas Weiss holds several cutting-edge patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Thomas Weiss has established himself as a leading figure in the tech industry, having worked for renowned companies such as Tech Innovations Inc. and FutureTech Solutions. His innovative solutions have revolutionized various sectors, earning him accolades and recognition.

Collaborations: Throughout his career, Thomas Weiss has collaborated with top researchers, engineers, and scientists to bring his inventions to life. His ability to work in multidisciplinary teams has led to the development of groundbreaking technologies that have had a lasting impact on society.

Conclusion: Thomas Weiss's passion for innovation, coupled with his dedication to pushing the boundaries of technology, has solidified his reputation as a visionary inventor. His relentless pursuit of excellence continues to inspire the next generation of inventors and shape the future of technological advancements.

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