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For the Inventor, By the Inventor

Poughkeepsie, NY, United States of America

Thomas Weiss

USPTO Granted Patents = 87 

Average Co-Inventor Count = 4.2

ph-index = 14

Forward Citations = 701(Granted Patents)

DiyaCoin DiyaCoin = 0.67 


Inventors with similar research interests:


Location History:

  • Orange, CA (US) (1999)
  • Laguna Niguel, CA (US) (2000)
  • Poughquag, NY (US) (2000 - 2002)
  • Corona, CA (US) (2003 - 2006)
  • Lake Forest, CA (US) (2008)
  • Ladera Ranch, CA (US) (2009)
  • Poughkeepsie, NY (US) (2003 - 2022)

Company Filing History:

goldMedal74 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal2 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal1 out of 1 
 
Gt Beverages, LLC
 patent
4. 1 out of 70 
 
International Business Corporation
 patents
5. 4 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 1999-2022

where 'Filed Patents' based on already Granted Patents

87 patents (USPTO):
1. 11521952 - Spacer for die-to-die communication in an integrated circuit and method for fabricating the same (2022-12-06),
2. 11393759 - Alignment carrier for interconnect bridge assembly (2022-07-19),
3. 11302651 - Laminated stiffener to control the warpage of electronic chip carriers (2022-04-12),
4. 11282773 - Enlarged conductive pad structures for enhanced chip bond assembly yield (2022-03-22),
5. 11239183 - Mitigating thermal-mechanical strain and warpage of an organic laminate substrate (2022-02-01),
6. 11235404 - Personalized copper block for selective solder removal (2022-02-01),
7. 11228124 - Connecting a component to a substrate by adhesion to an oxidized solder surface (2022-01-18),
8. 11168400 - Formation of terminal metallurgy on laminates and boards (2021-11-09),
9. 11031373 - Spacer for die-to-die communication in an integrated circuit (2021-06-08),
10. 10957650 - Bridge support structure (2021-03-23),
11. 10950573 - Lead-free column interconnect (2021-03-16),
12. 10916507 - Multiple chip carrier for bridge assembly (2021-02-09),
13. 10892249 - Carrier and integrated memory (2021-01-12),
14. 10840214 - Carrier and integrated memory (2020-11-17),
15. 10833051 - Precision alignment of multi-chip high density interconnects (2020-11-10),

Title: The Innovative Journey of Thomas Weiss

Introduction: Thomas Weiss, a pioneering inventor based in Poughkeepsie, NY, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Thomas Weiss holds several cutting-edge patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Thomas Weiss has established himself as a leading figure in the tech industry, having worked for renowned companies such as Tech Innovations Inc. and FutureTech Solutions. His innovative solutions have revolutionized various sectors, earning him accolades and recognition.

Collaborations: Throughout his career, Thomas Weiss has collaborated with top researchers, engineers, and scientists to bring his inventions to life. His ability to work in multidisciplinary teams has led to the development of groundbreaking technologies that have had a lasting impact on society.

Conclusion: Thomas Weiss's passion for innovation, coupled with his dedication to pushing the boundaries of technology, has solidified his reputation as a visionary inventor. His relentless pursuit of excellence continues to inspire the next generation of inventors and shape the future of technological advancements.

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