The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Mar. 19, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Charles L. Arvin, Poughkeepsie, NY (US);
Clement J. Fortin, Quebec, CA;
Christopher D. Muzzy, Burlington, VT (US);
Krishna R. Tunga, Wappingers Falls, NY (US);
Thomas Weiss, Poughkeepsie, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 23/53228 (2013.01); H01L 24/09 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16506 (2013.01);
Abstract
Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.