= 0.58 Inventors with similar research interests:
Location History:
- Essex Junction, VT (US) (2013 - 2015)
- Burlington, VT (US) (2004 - 2022)
Company Filing History:
121 out of 164,108 
18 out of 5,671 
1 out of 135 
Years Active: 2004-2022
Title: Christopher David Muzzy: Innovations in Semiconductor Chip Packaging and Lead-Free Solder Joining
Introduction:
In the world of semiconductor technology, Burlington-based inventor Christopher David Muzzy has made significant contributions through his numerous patents and innovations. With over 140 patents to his name, Muzzy's expertise lies in the development of cutting-edge semiconductor chip packages and advancements in lead-free solder joining techniques.
Latest Patents:
Among Muzzy's latest patents is the invention of "Mixed UBM and mixed pitch on a single die." This method involves forming a semiconductor chip package with a mixed under-bump metallization (UBM) size and pitch on a single die. By applying a solder bump calculated to ensure equal volumes of solder across different regions of the die, this innovation addresses key challenges in semiconductor packaging.
Another noteworthy patent in Muzzy's portfolio is "Lead-free solder joining of electronic structures." This method focuses on joining a semiconductor device and a laminate substrate (or two laminate substrates) while utilizing lead-free solders and compositions. By carefully selecting lead-free materials with varying liquidus temperatures, Muzzy enables the joining and removal of components without disturbing other elements on the laminate substrate.
Career Highlights:
Muzzy has worked with prestigious companies in the technology industry, including IBM (International Business Machines Corporation) and Globalfoundries Inc. His contributions to these organizations have greatly influenced advancements in the field of semiconductor technology. Muzzy's expertise in chip packaging and solder joining techniques has paved the way for more efficient and reliable electronic devices.
Collaborations:
Throughout his career, Muzzy has collaborated with notable individuals within the industry. Two of his colleagues who have contributed to his innovative endeavors are Wolfgang Sauter and Jeffrey P Gambino. The collective knowledge and expertise of these individuals have undoubtedly played a vital role in the development and implementation of Muzzy's groundbreaking ideas.
Conclusion:
Christopher David Muzzy's expertise in semiconductor chip packaging and lead-free solder joining has brought about significant advancements in the field of electronics. With an impressive portfolio of over 140 patents, Muzzy's contributions to the development of cutting-edge technologies have helped shape the landscape of the semiconductor industry.
His inventions, such as the mixed UBM and mixed pitch on a single die, and his lead-free solder joining techniques, demonstrate his commitment to improving chip packaging and ensuring environmentally friendly practices. As the industry continues to evolve, Muzzy's contributions will undoubtedly stand as a testament to his dedication to innovation and the pursuit of technological advancements.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.