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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10586782 B1

PDFFull Text
Date of Patent:
Mar. 10, 2020

Filed:

Jul. 01, 2017

Lead-free solder joining of electronic structures

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles L. Arvin, Poughkeepsie, NY (US);

Clement J. Fortin, Quebec, CA;

Christopher D. Muzzy, Burlington, VT (US);

Brian W. Quinlan, Poughkeepsie, NY (US);

Thomas A. Wassick, Lagrangeville, NY (US);

Thomas Weiss, Poughkeepsie, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorney:

Law Offices of Ira D. Blecker, P.C.

Primary Examiner:

William A Harriston

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 23/49811 (2013.01); H01L 23/49894 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 23/49816 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 2224/03318 (2013.01); H01L 2224/03849 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16012 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16501 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0135 (2013.01); H01L 2924/20102 (2013.01); H01L 2924/20103 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/20106 (2013.01); H01L 2924/20107 (2013.01);
Abstract

A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.

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