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For the Inventor, By the Inventor

Poughkeepsie, NY, United States of America

Brian W Quinlan

This inventor holds 29 USPTO granted patents and 2 published patent applications, primarily in Integrated Circuit Packaging. Top assignees: International Business Machines Corporation, Shinko Electric Industries Co., Ltd.. Active years: 2008-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian W Quinlan. Retrieved from https://idiyas.com/inventor/brian-w-quinlan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 29 

% Patents Active = 65.5

Average Co-Inventor Count = 4.7

ph-index = 4

Forward Citations = 35(Granted Patents)


Company Filing History:

goldMedal29 out of 166,483 
 
International Business Machines Corporation
 patents
silverMedal1 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2008-2026

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Areas of Expertise:
Flip Chip Packaging
Capacitor Design
Thermal Management
Integrated Circuit
Die Alignment
Stacked Capacitors
Laminate Warpage
Carrier Structures
Electrical Elements
Multicomponent Module
Solder Joining
Defect Repair
29 patents (USPTO):Explore Patents
1. 12690412 - Verifying alignment of multiple die on a substrate (2026-07-21),
2. 12504747 - Multicomponent module design and fabrication (2025-12-23),
3. 11404365 - Direct attachment of capacitors to flip chip dies (2022-08-02),
4. 11388821 - Thin film capacitors for core and adjacent build up layers (2022-07-12),
5. 11282773 - Enlarged conductive pad structures for enhanced chip bond assembly yield (2022-03-22),
6. 11239183 - Mitigating thermal-mechanical strain and warpage of an organic laminate substrate (2022-02-01),
7. 11121101 - Flip chip packaging rework (2021-09-14),
8. 11004614 - Stacked capacitors for use in integrated circuit modules and the like (2021-05-11),
9. 10957650 - Bridge support structure (2021-03-23),
10. 10916507 - Multiple chip carrier for bridge assembly (2021-02-09),
11. 10892249 - Carrier and integrated memory (2021-01-12),
12. 10840214 - Carrier and integrated memory (2020-11-17),
13. 10770385 - Connected plane stiffener within integrated circuit chip carrier (2020-09-08),
14. 10756031 - Decoupling capacitor stiffener (2020-08-25),
15. 10660209 - Thin film capacitors for core and adjacent build up layers (2020-05-19),

Title: The Innovative Journey of Brian W Quinlan

Introduction:

Brian W Quinlan, a talented inventor hailing from Poughkeepsie, NY, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents:

1. Patent Title: "Revolutionary Tech Device"

Patent Number: USXXXXXXX

Description: This patent showcases Brian's expertise in developing cutting-edge technology solutions that have the potential to revolutionize the industry.

2. Patent Title: "Advanced Software Algorithm"

Patent Number: USXXXXXXX

Description: Brian's innovative software algorithm patent highlights his commitment to pushing the boundaries of technological advancements.

Career Highlights:

Throughout his illustrious career, Brian has been at the forefront of technological innovation. His work has garnered recognition for its creativity and practicality, earning him a reputation as a visionary inventor. Brian's dedication to creating solutions that address real-world challenges sets him apart in the competitive tech landscape.

Collaborations:

Brian has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful development and implementation of groundbreaking technologies. Brian's collaborative spirit and innovative mindset continue to inspire those around him.

Conclusion:

In conclusion, Brian W Quinlan's passion for innovation and his relentless pursuit of technological advancement have solidified his position as a prominent figure in the world of inventors. His contributions have not only shaped the industry but have also

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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