The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2022
Filed:
May. 07, 2019
International Business Machines Corporation, Armonk, NY (US);
Charles L. Arvin, Poughkeepsie, NY (US);
Bhupender Singh, Fishkill, NY (US);
Mark Kapfhammer, Poughkeepsie, NY (US);
Brian W. Quinlan, Poughkeepsie, NY (US);
Sylvain Pharand, Quebec, CA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
An integrated circuit package includes a substrate, a flip chip die, and a capacitor. The flip chip die is attached to the substrate via die-to-substrate interconnects. The capacitor is attached to the flip chip die via capacitor-to-die interconnects so that the capacitor occupies a region between the flip chip die and the substrate. Such placement of the capacitor on a flip chip die has the advantage of reducing the distance between the capacitor and its core, thereby reducing unwanted line inductance and series resistance effects. Integrated circuit performance is thereby enhanced.