IDiyas

For the Inventor, By the Inventor

Fishkill, NY, United States of America

Bhupender Singh

USPTO Granted Patents = 12 


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal12 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 2021-2023

where 'Filed Patents' based on already Granted Patents

12 patents (USPTO):
1. 11756930 - High bandwidth module (2023-09-12),
2. 11694992 - Near tier decoupling capacitors (2023-07-04),
3. 11521952 - Spacer for die-to-die communication in an integrated circuit and method for fabricating the same (2022-12-06),
4. 11410894 - Polygon integrated circuit (IC) packaging (2022-08-09),
5. 11404365 - Direct attachment of capacitors to flip chip dies (2022-08-02),
6. 11393759 - Alignment carrier for interconnect bridge assembly (2022-07-19),
7. 11282773 - Enlarged conductive pad structures for enhanced chip bond assembly yield (2022-03-22),
8. 11211262 - Electronic apparatus having inter-chip stiffener (2021-12-28),
9. 11201136 - High bandwidth module (2021-12-14),
10. 11031373 - Spacer for die-to-die communication in an integrated circuit (2021-06-08),
11. 11031343 - Fins for enhanced die communication (2021-06-08),
12. 11004614 - Stacked capacitors for use in integrated circuit modules and the like (2021-05-11),

Title: Bhupender Singh: Innovator in Semiconductor Technology

Introduction

Bhupender Singh is a prominent inventor based in Fishkill, NY (US), known for his significant contributions to semiconductor technology. With a total of 12 patents to his name, Singh has made remarkable advancements in the field, particularly in high bandwidth modules and integrated circuit package structures.

Latest Patents

Singh's latest patents include a high bandwidth module that features a substrate with multiple contact regions and a spacer-chip assembly. This assembly consists of at least first and second semiconductor dies, each equipped with electrical interconnect pillars and contact pads. The innovative design allows for efficient electrical coupling between the semiconductor dies and the substrate. Another notable patent is for near tier decoupling capacitors, which describes an integrated circuit package structure that includes a chip carrier substrate and a processor die. This design enhances the interconnect structure of chips, ensuring optimal performance without interference from lateral escape wiring lines.

Career Highlights

Bhupender Singh is currently employed at International Business Machines Corporation (IBM), where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in developing technologies that enhance the performance and efficiency of electronic devices.

Collaborations

Singh has collaborated with notable colleagues, including Charles Leon Arvin and Mark William Kapfhammer. Their combined expertise has contributed to the successful development of advanced semiconductor technologies.

Conclusion

Bhupender Singh's contributions to the field of semiconductor technology are significant and impactful. His innovative patents and collaborations reflect his dedication to advancing technology in meaningful ways.

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