The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

Jun. 21, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles Leon Arvin, Poughkeepsie, NY (US);

Richard Francis Indyk, Saratoga Springs, NY (US);

Bhupender Singh, Fishkill, NY (US);

Jon Alfred Casey, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 25/0655 (2013.01);
Abstract

Semiconductor structures are provided in which a first chip on a substrate has at least one first protruding section, the first protruding section including first interconnect locations, a second chip on the substrate having at least one second protruding section, the second protruding section including second interconnect locations and the first chip and the second chip are arranged such that the first protruding section is interdigitated with the second protruding section.


Find Patent Forward Citations

Arvin, Charles. (2021). Fins for enhanced die communication (U.S. Patent No. 11031343). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11031343

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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