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Poughkeepsie, NY, United States of America

Jon Alfred Casey

USPTO Granted Patents = 80

Average Co-Inventor Count = 5.4

ph-index = 13

Forward Citations = 809(Granted Patents)

Forward Citations (Not Self Cited) = 802(Dec 10, 2025)

Inventors with similar research interests:

Location History:

LaGrange, NY (US) (1995 - 1996)
Poughhkeepsie, NY (US) (2007)
Pooghkeepsie, NY (US) (2016)
Poughkeepsie, NY (US) (1989 - 2023)

Company Filing History:

79 out of 164,197

International Business Machines Corporation

The Carborundum Company

Crystalline Materials Corporation

4. 1 out of 832,843

Other

patents

where one patent can have more than one assignee

Years Active: 1989-2025

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Areas of Expertise:

Multicomponent Module Design

Natural Draft Cooling

Semiconductor Wafer Integrity

Integrated Circuit Packaging

Heterogeneous Integration Packaging

Thermal Management Solutions

Multi-Chip Module Systems

Electromigration Mitigation

Thermal Expansion Particles

Via Filling Techniques

Low-K Dielectric Materials

Thermoelectric Device Fabrication

80 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12504747 - Multicomponent module design and fabrication (2025-12-23),

2. 12468293 - Multicomponent module design and fabrication (2025-11-11),

3. 11825592 - Electronic device console with natural draft cooling (2023-11-21),

4. 11569181 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2023-01-31),

5. 11410894 - Polygon integrated circuit (IC) packaging (2022-08-09),

6. 11177217 - Direct bonded heterogeneous integration packaging structures (2021-11-16),

7. 11031343 - Fins for enhanced die communication (2021-06-08),

8. 10892233 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2021-01-12),

9. 10834808 - Electronic device console with natural draft cooling (2020-11-10),

10. 10580738 - Direct bonded heterogeneous integration packaging structures (2020-03-03),

11. 9601423 - Under die surface mounted electrical elements (2017-03-21),

12. 9477568 - Managing interconnect electromigration effects (2016-10-25),

13. 9226426 - Electronic device console with natural draft cooling (2015-12-29),

14. 8786059 - Passivation layer surface topography modifications for improved integrity in packaged assemblies (2014-07-22),

15. 8680670 - Multi-chip module system with removable socketed modules (2014-03-25),

Title: The Innovative Mind of Jon Alfred Casey

Introduction:

Jon Alfred Casey, a brilliant inventor hailing from Poughkeepsie, NY, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Jon Alfred Casey's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights:

Throughout his illustrious career, Jon Alfred Casey has consistently pushed the boundaries of technological advancement. His work has garnered international recognition and has been instrumental in shaping the future of various industries.

Collaborations:

Jon Alfred Casey has collaborated with leading tech companies, research institutions, and universities to further his innovative projects. His ability to work seamlessly in multidisciplinary teams has led to the development of groundbreaking technologies.

Conclusion:

In conclusion, Jon Alfred Casey's passion for innovation and his relentless drive to create a positive impact on society through his inventions make him a true pioneer in the world of technology. His work continues to inspire future generations of inventors and innovators.

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