The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Oct. 31, 2018
International Business Machines Corporation, Armonk, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
Shidong Li, Poughkeepsie, NY (US);
Steve Ostrander, Poughkeepsie, NY (US);
Jon Alfred Casey, Poughkeepsie, NY (US);
Brian Richard Sundlof, Verbank, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Moisture-driven degradation of a crack stop in a semiconductor die is mitigated by forming a groove in an upper surface of the die between an edge of the die and the crack stop; entirely filling the groove with a moisture barrier material; preventing moisture penetration of the semiconductor die by presence of the moisture barrier material; and dissipating mechanical stress in the moisture barrier material without presenting a stress riser in the bulk portion of the die. The moisture barrier material is at least one of moisture-absorbing, moisture adsorbing, and hydrophobic.