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For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

Sushumna Iruvanti

USPTO Granted Patents = 61 

Average Co-Inventor Count = 5.3

ph-index = 19

Forward Citations = 948(Granted Patents)

Forward Citations (Not Self Cited) = 919(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hopewell Junction, NY (US) (2011 - 2013)
  • Wappingers Falls, NY (US) (1992 - 2024)

Company Filing History:

goldMedal60 out of 164,197 
 
International Business Machines Corporation
 patents
silverMedal1 out of 1,993 
 
The State University of New York
 patents
bronzeMedal1 out of 612 
 
Rensselaer Polytechnic Institute
 patents
where one patent can have more than one assignee

Years Active: 1992-2024

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Areas of Expertise:
Hardware Security Module
Thermal Interface Materials
Electronic Package Cooling
Integrated Circuit Packaging
Thermal Conductance
Moisture Mitigation
Chip Warpage Control
Thermal Paste Containment
Microelectronics Assembly
Polymer Composites
Reworkable Encapsulants
Multi-Chip Modules
61 patents (USPTO):Explore Patents
1. 11882645 - Multi chip hardware security module (2024-01-23),
2. 11569181 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2023-01-31),
3. 11302651 - Laminated stiffener to control the warpage of electronic chip carriers (2022-04-12),
4. 11264306 - Hybrid TIMs for electronic package cooling (2022-03-01),
5. 11158562 - Conformal integrated circuit (IC) device package lid (2021-10-26),
6. 11152282 - Localized catalyst for enhanced thermal interface material heat transfer (2021-10-19),
7. 10892233 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2021-01-12),
8. 10804181 - Heterogeneous thermal interface material for corner and or edge degradation mitigation (2020-10-13),
9. 10636746 - Method of forming an electronic package (2020-04-28),
10. 10607928 - Reduction of laminate failure in integrated circuit (IC) device carrier (2020-03-31),
11. 10593564 - Lid attach optimization to limit electronic package warpage (2020-03-17),
12. 10381276 - Test cell for laminate and method (2019-08-13),
13. 10332813 - Lid attach optimization to limit electronic package warpage (2019-06-25),
14. 10249548 - Test cell for laminate and method (2019-04-02),
15. 10083886 - Lid attach optimization to limit electronic package warpage (2018-09-25),

Title: Sushumna Iruvanti - Pioneering Inventor from Wappingers Falls

Introduction: Sushumna Iruvanti is a trailblazing inventor based in Wappingers Falls, NY, known for her innovative contributions to various fields.

Latest Patents: Sushumna Iruvanti holds several patents in the areas of renewable energy technologies, sustainable agriculture practices, and advanced medical devices.

Career Highlights: With a background in engineering and a passion for problem-solving, Sushumna has led groundbreaking projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout her career, Sushumna Iruvanti has collaborated with leading research institutions, universities, and companies to bring her inventions to life and make a positive impact on society.

Conclusion: Sushumna Iruvanti's dedication to innovation and her commitment to creating a better world through her inventions make her a true inspiration in the field of technology and beyond.

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