Wappingers Falls, NY, United States of America

Sushumna Iruvanti

This inventor holds 62 USPTO granted patents and 3 published patent applications, primarily in Thermal Interface Materials (CPC class H01L). Top assignees: International Business Machines Corporation, Rensselaer Polytechnic Institute, The State University of New York. Active years: 1992-2026.

USPTO Granted Patents = 62 (Patent Applications = 3)

% Patents Active = 72.6

Average Co-Inventor Count = 5.3

ph-index = 19

Forward Citations = 961(Granted Patents)

Forward Citations (Not Self Cited) = 919(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hopewell Junction, NY (US) (2011 - 2013)
Wappingers Falls, NY (US) (1992 - 2024)

Company Filing History:

61 out of 166,264

International Business Machines Corporation

patents

1 out of 646

Rensselaer Polytechnic Institute

patents

1 out of 2,043

The State University of New York

patents

where one patent can have more than one assignee

Years Active: 1992-2026

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Areas of Expertise:

Thermal Interface Materials

Electronic Packaging

Semiconductor Wafers

Moisture Mitigation

Thermal Conductance

Laminated Stiffener

Chip Cooling

Warpage Control

Thermal Paste

Multi-Chip Modules

High Conductivity

Circuit Chip Packaging

62 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12750949 - Tamper-detect assemblies including heat sink covers with integrated tamper-detect circuitry (2026-09-29),

2. 11882645 - Multi chip hardware security module (2024-01-23),

3. 11569181 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2023-01-31),

4. 11302651 - Laminated stiffener to control the warpage of electronic chip carriers (2022-04-12),

5. 11264306 - Hybrid TIMs for electronic package cooling (2022-03-01),

6. 11158562 - Conformal integrated circuit (IC) device package lid (2021-10-26),

7. 11152282 - Localized catalyst for enhanced thermal interface material heat transfer (2021-10-19),

8. 10892233 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2021-01-12),

9. 10804181 - Heterogeneous thermal interface material for corner and or edge degradation mitigation (2020-10-13),

10. 10636746 - Method of forming an electronic package (2020-04-28),

11. 10607928 - Reduction of laminate failure in integrated circuit (IC) device carrier (2020-03-31),

12. 10593564 - Lid attach optimization to limit electronic package warpage (2020-03-17),

13. 10381276 - Test cell for laminate and method (2019-08-13),

14. 10332813 - Lid attach optimization to limit electronic package warpage (2019-06-25),

15. 10249548 - Test cell for laminate and method (2019-04-02),

Title: Sushumna Iruvanti - Pioneering Inventor from Wappingers Falls

Introduction: Sushumna Iruvanti is a trailblazing inventor based in Wappingers Falls, NY, known for her innovative contributions to various fields.

Latest Patents: Sushumna Iruvanti holds several patents in the areas of renewable energy technologies, sustainable agriculture practices, and advanced medical devices.

Career Highlights: With a background in engineering and a passion for problem-solving, Sushumna has led groundbreaking projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout her career, Sushumna Iruvanti has collaborated with leading research institutions, universities, and companies to bring her inventions to life and make a positive impact on society.

Conclusion: Sushumna Iruvanti's dedication to innovation and her commitment to creating a better world through her inventions make her a true inspiration in the field of technology and beyond.