The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Jun. 19, 2020
International Business Machines Corporation, Armonk, NY (US);
Charles Leon Arvin, Poughkeepsie, NY (US);
Kevin Drummond, Wappingers Falls, NY (US);
Kenneth Charles Marston, Poughquag, NY (US);
Chris Muzzy, Burlington, VT (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An IC device package includes an IC device that is connected to a lid by a thermal interface material (TIM). A catalyst material is formed upon one or more regions upon an upper surface of the IC device and/or an under surface of the lid. The catalyst material increases the rate of crosslinking of polymer chains of the TIM during TIM curing and/or increases the strength of crosslinks that link polymer chains of the TIM during TIM curing. The catalytically enhanced regions have a higher coefficient of heat transfer relative to non-catalytically enhanced regions. Therefore, the catalytically enhanced regions efficiently transfer heat from the IC device to the lid.