The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Feb. 26, 2018
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Kamal K. Sikka, Poughkeepsie, NY (US);
Krishna R. Tunga, Wappingers Falls, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Thomas Weiss, Poughkeepsie, NY (US);
Shidong Li, Poughkeepsie, NY (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/027 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/0274 (2013.01); H01L 21/4846 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H05K 3/303 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/171 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.