Hilton T Toy

Title: **The Innovations of Hilton T. Toy: A Visionary in Chip Packaging Technology**

Introduction

Hilton T. Toy, based in Hopewell Junction, NY, is an influential inventor known for his contributions to the field of electronic packaging, holding an impressive total of 86 patents. His innovative approaches have significantly advanced the technology utilized in chip assembly and thermal management.

Latest Patents

Among his latest inventions are two noteworthy patents:

1. **Electronic package structure with offset stacked chips and top and bottom side cooling lid** - This electronic structure features offset three-dimensional stacked chips complemented by a unique two-piece lid that is specifically designed to extract heat effectively from both the bottom and top of the stacked chips.

2. **Mitigating cooldown peeling stress during chip package assembly** - In this innovation, Hilton has developed a lidded chip package apparatus that mitigates latent thermal stress in the under-chip high-CTE layer. The design involves adhering the lid of the package to the substrate during the same thermal excursion as the underfill process, leading to improved structural integrity by reducing latent thermal stress as the assembly cools.

Career Highlights

Hilton T. Toy has made significant contributions while working at prestigious companies, including IBM and Globalfoundries Inc. His work has not only led to numerous patents but has also positioned him as a leader in the electronic packaging sector, driving innovations that benefit manufacturers and consumers alike.

Collaborations

Throughout his career, Hilton has collaborated with talented professionals, including Kamal Kumar Sikka and Jeffrey Allen Zitz. These partnerships have played a crucial role in the development of groundbreaking technologies and patent filings.

Conclusion

With a remarkable portfolio of patents and a career dedicated to improving electronic packaging, Hilton T. Toy stands out as a pioneering inventor. His innovations continue to shape the future of technology, ensuring efficient heat management and durability in chip packaging.