Hopewell Junction, NY, United States of America

Hilton T Toy

This inventor holds 86 USPTO granted patents and 1 published patent application, primarily in Electronic Packaging (CPC class H01L2224-32245). Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1998-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hilton T Toy. Retrieved from https://idiyas.com/inventor/hilton-t-toy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 86 (Patent Applications = 1)

% Patents Active = 58.1

Average Co-Inventor Count = 4.8

ph-index = 18

Forward Citations = 992(Granted Patents)

Forward Citations (Not Self Cited) = 927(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Wappingers Falls, NY (US) (1998 - 2006)
Hopewll Junction, NY (US) (2009)
Hopewell Junction, NY (US) (2004 - 2024)

Company Filing History:

84 out of 166,325

International Business Machines Corporation

Years Active: 1998-2024

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Areas of Expertise:

Electronic Package

Thermal Management

Chip Module

High Density Interconnects

Cooling Structure

Stiffening Frame

Multichip Module

LGA Socket

Warpage Control

Adhesive Array

Semiconductor Devices

Offset Stacked Chips

86 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11887908 - Electronic package structure with offset stacked chips and top and bottom side cooling lid (2024-01-30),

2. 11545444 - Mitigating cooldown peeling stress during chip package assembly (2023-01-03),

3. 11430710 - Lid/heat spreader having targeted flexibility (2022-08-30),

4. 11302651 - Laminated stiffener to control the warpage of electronic chip carriers (2022-04-12),

5. 11146003 - Pluggable LGA socket for high density interconnects (2021-10-12),

6. 10978314 - Multi integrated circuit chip carrier package (2021-04-13),

7. 10905029 - Cooling structure for electronic boards (2021-01-26),

8. 10892170 - Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader (2021-01-12),

9. 10832987 - Managing thermal warpage of a laminate (2020-11-10),

10. 10757833 - Cooling structure for electronic boards (2020-08-25),

11. 10636746 - Method of forming an electronic package (2020-04-28),

12. 10593564 - Lid attach optimization to limit electronic package warpage (2020-03-17),

13. 10566215 - Method of fabricating a chip module with stiffening frame and orthogonal heat spreader (2020-02-18),

14. 10542636 - Cooling structure for electronic boards (2020-01-21),

15. 10541156 - Multi integrated circuit chip carrier package (2020-01-21),

Title: **The Innovations of Hilton T. Toy: A Visionary in Chip Packaging Technology**

Introduction

Hilton T. Toy, based in Hopewell Junction, NY, is an influential inventor known for his contributions to the field of electronic packaging, holding an impressive total of 86 patents. His innovative approaches have significantly advanced the technology utilized in chip assembly and thermal management.

Latest Patents

Among his latest inventions are two noteworthy patents:

1. **Electronic package structure with offset stacked chips and top and bottom side cooling lid** - This electronic structure features offset three-dimensional stacked chips complemented by a unique two-piece lid that is specifically designed to extract heat effectively from both the bottom and top of the stacked chips.

2. **Mitigating cooldown peeling stress during chip package assembly** - In this innovation, Hilton has developed a lidded chip package apparatus that mitigates latent thermal stress in the under-chip high-CTE layer. The design involves adhering the lid of the package to the substrate during the same thermal excursion as the underfill process, leading to improved structural integrity by reducing latent thermal stress as the assembly cools.

Career Highlights

Hilton T. Toy has made significant contributions while working at prestigious companies, including IBM and Globalfoundries Inc. His work has not only led to numerous patents but has also positioned him as a leader in the electronic packaging sector, driving innovations that benefit manufacturers and consumers alike.

Collaborations

Throughout his career, Hilton has collaborated with talented professionals, including Kamal Kumar Sikka and Jeffrey Allen Zitz. These partnerships have played a crucial role in the development of groundbreaking technologies and patent filings.

Conclusion

With a remarkable portfolio of patents and a career dedicated to improving electronic packaging, Hilton T. Toy stands out as a pioneering inventor. His innovations continue to shape the future of technology, ensuring efficient heat management and durability in chip packaging.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: