International Business Machines Corporation

Globalfoundries Inc.

Hilton T Toy

Kamal Kumar Sikka

Jeffrey Allen Zitz

David L Edwards

Sushumna Iruvanti

Shidong Li

Lewis Sigmund Goldmann

Raed A Sherif

Frank Louis Pompeo

Patrick Anthony Coico

Evan G Colgan

Thomas Weiss

Krishna R Tunga

Kenneth Charles Marston

Mark G Courtney

Paul F Bodenweber

Marcus E Interrante

Benjamin V Fasano

Peter Jeffrey Brofman

Raymond A Jackson

William Edward Sablinski

Kathleen Ann Stalter

Michael A Gaynes

Paul Francis Fortier

Shaji Farooq

Yi Pan

Jeffrey Thomas Coffin

Randall Jason Werner

Steven Paul Ostrander

Glenn Graham Daves

Da-Yuan Shih

Govindarajan Natarajan

Krishna Gandhi Sachdev

David L Questad

Alan Frederic Benner

Thomas Edward Lombardi

David C Linnell

Daniel George Berger

Jamil A Wakil

James H Covell

Gregg B Monjeau

Suresh D Kadakia

Gregory Blair Martin

Wei Zou

Li Ming Wang

Kelly May Chioujones

Michael J Ellsworth, Jr

Mukta G Farooq

Peter Alfred Gruber

Jeffrey Donald Gelorme

Raschid Jose Bezama

Katsuyuki Sakuma

Eric D Perfecto

Edmund D Blackshear

Lannie R Bolde

Ajay Prabhakar Giri

Tuhin Sinha

John Blake Pavelka

Dale Curtis McHerron

Elaine Cyr

William Frederick Shutler

Armando S Cammarano

Martin Beaumier

David J Womac

Stephen S Drofitz, Jr

Roger Lam

Joseph Ying-Yuen Chan

Kathryn R Lange

Roger R Schmidt

Charles Leon Arvin

Sung Kwon Kang

Bruce Kenneth Furman

Sudipta Kumar Ray

How Tzu Lin

Mario John Interrante

Subhash Laxman Shinde

James N Humenik

John Harold Magerlein

Michael Sean June

Amilcar R Arvelo

Donald W Henderson

Mark William Kapfhammer

Ravi K Bonam

Hsichang Liu

Jay A Bunt

Jiantao Zheng

Hongqing Zhang

Richard D Langlois

Taryn J Davis

David J Lewison

Kathryn C Rivera

Chenzhou Lian

Paul A Zucco

Michael J Emmett

L Wynn Herron

Ellyn M Ingalls

Jaimal M Williamson

An electronic structure includes offset three-dimensional stacked chips; and a two-piece lid structure configured to extract heat from the bottom and top of the stacked chips.

Electronic package structure with offset stacked chips and top and bottom side cooling lid

A lidded chip package apparatus has reduced latent thermal stress in an under-chip high-CTE layer of the chip package because the lid of the package was adhered to a substrate of the package and cured during a same thermal excursion as when underfill was dispensed and cured under a chip of the package, and the chip package was cooled from the combined underfill and lidding process to room temperature with the lid adhered to the chip and the substrate, thereby reducing latent thermal stress in the under-chip high-CTE layer of the chip package.

Mitigating cooldown peeling stress during chip package assembly

An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

Lid/heat spreader having targeted flexibility

A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

Laminated stiffener to control the warpage of electronic chip carriers

Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.

Pluggable LGA socket for high density interconnects

A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned against a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment features within the lid with one or more respective alignment features of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, the lid be loaded against respective IC chips, and the lid may be loaded against the carrier. While under compression, thermal interface material between respective the lid and respective IC chips and seal band material between the lid and the carrier may be cured.

Multi integrated circuit chip carrier package

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

Cooling structure for electronic boards

An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, a first directional heat spreader, and a second directional heat spreader. Presented herein is a fabrication method that includes attaching the stiffening frame to the carrier. The stiffening frame includes a central opening, a base portion, a first pair of opposing sidewalls, and a second pair of opposing sidewalls. The method includes electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening. The method includes thermally contacting the first directional heat spreader to the semiconductor chip. The first directional heat spreader transfers heat from the semiconductor chip towards the first pair of opposing sidewalls. The method includes thermally contacting the second directional heat spreader to the first directional heat spreader. The second directional heat spreader transfers heat from the first directional heat spreader towards the second pair of opposing sidewalls.

Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader

A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.

Managing thermal warpage of a laminate

Method of forming an electronic package

An electronic package includes a carrier and a semiconductor chip. In a first aspect, a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness.

Lid attach optimization to limit electronic package warpage

A method includes electrically connecting an IC chip module to a motherboard and thermally contacting a heat sink to the IC chip module. The IC chip module includes a carrier comprising a top surface and a bottom surface configured to be electrically connected to the motherboard. The IC chip module includes a stiffening frame attached to the carrier top surface. The stiffening frame includes a base portion that has a central opening and a plurality of opposing sidewalls. The IC chip module further includes a semiconductor chip electrically connected to the carrier top surface and concentrically arranged within the central opening. The IC chip module further includes a first directional heat spreader thermally contacting the semiconductor chip. The first directional heat spreader includes a directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards first opposing sidewalls.

Method of fabricating a chip module with stiffening frame and orthogonal heat spreader

A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned within a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment receptacles within the lid with one or more respective alignment protrusions of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, respective lid pedestals may be loaded toward respective IC chips, and an integral lid foot may be loaded toward the carrier. While under compression, thermal interface material between respective lid pedestals and respective IC chips and seal band material between the integral foot and the carrier may be cured.

Growing community of inventors

Hopewell Junction, NY, United States of America

Hilton T Toy