The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Aug. 22, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Alan F. Benner, Poughkeepsie, NY (US);

Benjamin Vito Fasano, New Windsor, NY (US);

Paul Francis Fortier, Richelieu, CA;

Hilton T. Toy, Hopewell Junction, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/70 (2011.01); H01R 4/50 (2006.01); H01R 12/77 (2011.01); H01R 12/52 (2011.01); H01R 12/71 (2011.01); H01R 12/79 (2011.01);
U.S. Cl.
CPC ...
H01R 12/7076 (2013.01); H01R 4/5083 (2013.01); H01R 12/774 (2013.01); H01R 12/523 (2013.01); H01R 12/716 (2013.01); H01R 12/772 (2013.01); H01R 12/79 (2013.01);
Abstract

Embodiments provide for a method for pluggable Land Grid Array (LGA) socket for high density interconnects. A method includes inserting an electrical-to-optical transceiver into an opening of a channel housing that is positioned above a land grid array connector located on an electrical package. After the electrical-to-optical transceiver is inserted into the channel housing, a tapered opening remains between an upper portion of the channel housing above the electrical-to-optical transceiver, wherein a gap of the tapered opening decreases progressively starting from the opening. The method includes inserting a conductive wedge into the gap of the tapered opening prior to communications through the electrical-to-optical transceiver between a component on the electrical package and a component external to the electrical package.


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