The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Mar. 24, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Charles L. Arvin, Poughkeepsie, NY (US);

Marcus E. Interrante, Highland, NY (US);

Thomas E. Lombardi, Poughkeepsie, NY (US);

Hilton T. Toy, Hopewell Junction, NY (US);

Krishna R. Tunga, Wappingers Falls, NY (US);

Thomas Weiss, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H05K 1/02 (2006.01); H01L 23/42 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/42 (2013.01); H01L 23/5389 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H05K 1/0271 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A method of managing thermal warpage of a laminate which includes: assembling a stiffener and an adhesive on the laminate, the stiffener being a material that has a higher modulus of elasticity than the laminate; applying a force to deform the laminate a predetermined amount; heating the laminate, stiffener and adhesive to a predetermined temperature at which the adhesive cures to bond the stiffener to the laminate; cooling the laminate, stiffener and adhesive to a temperature below the predetermined temperature, the laminate maintaining its deformed shape.


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