Poughkeepsie, NY, United States of America

Thomas Edward Lombardi

This inventor holds 35 USPTO granted patents and 1 published patent application, primarily in Electronic Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1996-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thomas Edward Lombardi. Retrieved from https://idiyas.com/inventor/thomas-edward-lombardi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 35 

% Patents Active = 48.6

Average Co-Inventor Count = 5.4

ph-index = 5

Forward Citations = 131(Granted Patents)


Location History:

  • Wappingers Falls, NY (US) (1996)
  • Research Triangle Park, NC (US) (2012)
  • Hopewell Junction, NY (US) (2012 - 2013)
  • Poughkeepsie, NY (US) (1997 - 2023)

Company Filing History:


Years Active: 1996-2024

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Areas of Expertise:
Electronic Package
Thermal Warpage
Interconnects
Laminate Substrate
Chip Joining
Underfill Method
Surface Mount Connectors
Circuit Boards
Adhesive Array
Capillary Coverage
Decoupling Capacitors
Current-Carrying Capabilities
35 patents (USPTO):Explore Patents

Title: Thomas Edward Lombardi: A Pioneer in Electronic Packaging Innovations

Introduction

Thomas Edward Lombardi, an accomplished inventor based in Poughkeepsie, NY, has made significant contributions to the field of electronic packaging. With an impressive portfolio of 35 patents, Lombardi has emerged as a key figure in the advancement of technology related to integrated circuits and chip design. His work has facilitated innovations that have impacted various sectors of the technology industry.

Latest Patents

Among Lombardi's latest patents, two stand out due to their innovative approaches. The first patent describes an "Electronic package with varying interconnects." This patent details a flip chip device and the methods for its fabrication, which include an interconnect layer featuring multiple solder bumps of varying cross-sectional areas. This design enables tailored connections for enhanced device performance. The second notable patent is focused on "Near tier decoupling capacitors," where an integrated circuit package structure incorporates a chip carrier substrate and a plurality of chips surrounding a processor die. This intricate layout allows for efficient power distribution without interference from lateral escape wiring lines, showcasing Lombardi's focus on optimizing circuit designs for improved functionality.

Career Highlights

Lombardi's extensive career includes valuable roles at renowned companies such as International Business Machines Corporation (IBM) and Globalfoundries. His tenure at these organizations allowed him to work on cutting-edge technologies that have shaped the future of electronic systems. His expertise in electronic package design has garnered attention and respect within the industry.

Collaborations

Throughout his career, Thomas Edward Lombardi has collaborated with fellow innovators, including Thomas Weiss and David L. Questad. These partnerships have resulted in a synergistic exchange of ideas, contributing to Lombardi's ability to innovate and advance within the field of electronic packaging.

Conclusion

In conclusion, Thomas Edward Lombardi stands as a notable inventor whose contributions to electronic packaging have significantly impacted technological advancements. With 35 patents to his name, his ongoing work demonstrates the importance of innovation in the tech industry. As these advancements unfold, Lombardi’s legacy will undoubtedly inspire future generations of inventors and engineers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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