The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2017

Filed:

Dec. 15, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Benjamin V. Fasano, New Windsor, NY (US);

Mark W. Kapfhammer, Poughkeepsie, NY (US);

David J. Lewison, Wappingers Falls, NY (US);

Thomas E. Lombardi, Poughkeepsie, NY (US);

Thomas Weiss, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2225/06513 (2013.01);
Abstract

A technique relates to forming a chip assembly. Top and bottom chip stack elements containing solder pads and a solder material are provided. Soluble standoffs are applied to the bottom chip stack element. The chip stack elements are aligned to bring the top solder pad in proximity to the bottom solder pad and the temperature is raised to a temperature above the melting temperature of the solder material to form a connected chip assembly. The connected chip assembly is cooled to re-solidify the solder material and soluble standoffs are removed from the connected chip assembly.


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