The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Oct. 15, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kevin Drummond, Wappingers Falls, NY (US);

Thomas Lombardi, Poughkeepsie, NY (US);

Steve Ostrander, Poughkeepsie, NY (US);

Stephanie Allard, St-Hyacinthe, CA;

Catherine Dufort, Bromont, CA;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/31 (2013.01); H01L 24/83 (2013.01); H05K 1/11 (2013.01); H05K 3/321 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/831 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/1904 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10719 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A structure with controlled capillary coverage is provided and includes a substrate including one or more first contacts, a component and adhesive. The component includes one or more second contacts and a rib disposed at a distance from each of the one or more second contacts. The component is disposed such that the one or more second contacts are communicative with the one or more first contacts and corresponding surfaces of the substrate and the rib face each other at a controlled gap height to define a fill-space. The adhesive is dispensed at a discrete point whereby the adhesive is drawn to fill the fill-space by capillary action.


Find Patent Forward Citations

Loading…