The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
May. 28, 2019
International Business Machines Corporation, Armonk, NY (US);
Michael A. Gaynes, Vestal, NY (US);
Jeffrey D. Gelorme, Burlington, CT (US);
Robert P. Kuder, II, Hopewell Junction, NY (US);
Daniel J. Littrell, Carmel, NY (US);
Thomas E. Lombardi, Poughkeepsie, NY (US);
Marie-Claude Paquet, Quebec, CA;
Frank L. Pompeo, Redding, CT (US);
David L. Questad, Hopewell Junction, NY (US);
James Speidell, Poughquag, NY (US);
Sri M. Sri-Jayantha, Ossining, NY (US);
Son K. Tran, Endicott, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.