This inventor holds 55 USPTO granted patents, plus 1 CIPO patent, primarily in Integrated Circuit Technology (CPC class H05K). Top assignees: International Business Machines Corporation, Other. Active years: 1985-2023.
Inventors with similar research interests:
Location History:
- Carmel, NY (US) (1985 - 1990)
- Poqughquag, NY (US) (2001)
- St. Poughquag, NY (US) (2001)
- Pogughguag, NY (US) (2002)
- Poughquaq, NY (US) (2002)
- Poughguag, NY (US) (1998 - 2012)
- Poughhquag, NY (US) (2019)
- Poughquag, NY (US) (1993 - 2023)
Company Filing History:
54 out of 166,209 
1 out of 834,350 Years Active: 1985-2023
Areas of Expertise:
Title: Innovations of James L. Speidell: A Pioneer in Processor Technology
Introduction
James L. Speidell, based in Poughquag, NY, is a prolific inventor with a remarkable portfolio of 55 patents. His work primarily focuses on advancements in processor technology, particularly in the realms of wafer bonding and interconnect structures. With a background that includes significant contributions to IBM, Speidell is recognized for his innovative approaches that have the potential to revolutionize the field of supercomputing and electronic assembly.
Latest Patents
One of Speidell's latest patents, titled "Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer," presents a novel technique for bonding a processor wafer with a microchannel wafer/glass manifold. This invention enhances the integrity and performance of bonded wafer structures by utilizing a glass fixture designed to protect C4 solder bumps on chips during the bonding process. The inventive process involves precise alignment and securing of wafer components through a specialized metal fixture, ultimately facilitating the formation of robust bonded structures.
Another recent patent outlined by Speidell is the "Method and apparatus for strain relieving surface mount attached connectors." This patent describes an interconnect structure that integrates a component circuit board with a wafer connector assembly. It highlights the importance of reinforcing solder joints with adhesive to ensure reliable electrical connections, enhancing both performance and durability in electronic devices.
Career Highlights
Throughout his career, James L. Speidell has made significant strides in the field of electronics and engineering. His tenure at IBM notably shaped his expertise, positioning him as a key figure in processor innovation. His body of work exemplifies a commitment to enhancing the functionality and reliability of modern computing architectures through inventive solutions.
Collaborations
Speidell has collaborated with several distinguished professionals in his field, including colleagues such as Steven Alan Cordes and Peter Alfred Gruber. These collaborations have undoubtedly contributed to the refinement and success of his patented technologies, fostering an environment of innovation and teamwork.
Conclusion
James L. Speidell's innovations in processor technology and interconnect structures mark him as a significant inventor in the modern technological landscape. His contributions through his numerous patents reflect a dedication to driving advancements in computing that will influence future generations. His work continues to inspire innovation within the broader context of electronics and engineering.