The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Aug. 12, 2008
Steven A. Cordes, Yorktown Heights, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
John U. Knickerbocker, Monroe, NY (US);
James L. Speidell, Poughquag, NY (US);
Steven A. Cordes, Yorktown Heights, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
John U. Knickerbocker, Monroe, NY (US);
James L. Speidell, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.