The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Jun. 06, 2007
S. Jay Chey, Ossining, NY (US);
Steven A. Cordes, Yorktown Heights, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
John U. Knickerbocker, Monroe, NY (US);
James L. Speidell, Poughquag, NY (US);
S. Jay Chey, Ossining, NY (US);
Steven A. Cordes, Yorktown Heights, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
John U. Knickerbocker, Monroe, NY (US);
James L. Speidell, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.