The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Aug. 11, 2008
Steven A. Cordes, Yorktown Heights, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
John U. Knickerbocker, Monroe, NY (US);
James L. Speidell, Poughquag, NY (US);
Steven A. Cordes, Yorktown Heights, NY (US);
Peter A. Gruber, Mohegan Lake, NY (US);
John U. Knickerbocker, Monroe, NY (US);
James L. Speidell, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.