Marie-Claude Paquet

This inventor holds 17 USPTO granted patents and 2 published patent applications, primarily in Integrated Circuit Packaging. Top assignees: International Business Machines Corporation, Ultratech, Inc.. Active years: 2003-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Marie-Claude Paquet. Retrieved from https://idiyas.com/inventor/marie-claude-paquet

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 17 (Patent Applications = 2)

% Patents Active = 29.4

Average Co-Inventor Count = 5.2

ph-index = 4

Forward Citations = 41(Granted Patents)

Location History:

Bromont, CA (US) (2012)
Bromont, CA (2003 - 2019)
Quebec, CA (2017 - 2020)

Company Filing History:

16 out of 166,425

International Business Machines Corporation

Years Active: 2003-2020

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Areas of Expertise:

Surface Mount Connectors

Nanofiller

Optical Interface

Underfill Packaging

Adhesion Measurements

Passivation Layer

Chip Integrity

Transfer Molding

17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10750615 - Method and apparatus for strain relieving surface mount attached connectors (2020-08-18),

2. 10368441 - Method and apparatus for strain relieving surface mount attached connectors (2019-07-30),

3. 10338325 - Nanofiller in an optical interface (2019-07-02),

4. 9974179 - Method and apparatus for strain relieving surface mount attached connectors (2018-05-15),

5. 9698072 - Low-stress dual underfill packaging (2017-07-04),

6. 9627784 - Method and apparatus for strain relieving surface mount attached connectors (2017-04-18),

7. 9373559 - Low-stress dual underfill packaging (2016-06-21),

8. 8796049 - Underfill adhesion measurements at a microscopic scale (2014-08-05),

9. 8786059 - Passivation layer surface topography modifications for improved integrity in packaged assemblies (2014-07-22),

10. 8580673 - Underfill flow guide structures and method of using same (2013-11-12),

11. 8409980 - Underfill flow guide structures and method of using same (2013-04-02),

12. 8299581 - Passivation layer extension to chip edge (2012-10-30),

13. 8236615 - Passivation layer surface topography modifications for improved integrity in packaged assemblies (2012-08-07),

14. 8159067 - Underfill flow guide structures (2012-04-17),

15. 6988882 - Transfer molding of integrated circuit packages (2006-01-24),

Title: Marie-Claude Paquet: Innovator in Connector Technology

Introduction

Marie-Claude Paquet is a distinguished inventor based in Bromont, Canada. She has made significant contributions to the field of electrical engineering, particularly in the development of innovative connector technologies. With a total of 17 patents to her name, her work has had a profound impact on the industry.

Latest Patents

One of her latest patents is titled "Method and apparatus for strain relieving surface mount attached connectors." This invention describes an interconnect structure that includes a component circuit board containing a plurality of electrical components, along with a wafer connector assembly. The wafer connector assembly consists of multiple interconnect circuit boards that are electrically connected to the component circuit board through several rows of solder joints. Each interconnect circuit board features a connection end that includes at least one contact. Additionally, an adhesive is present to structurally reinforce at least one row of the solder joints that is proximate to the connection end of the interconnect circuit boards within the wafer assembly.

Career Highlights

Throughout her career, Marie-Claude has worked with notable companies such as IBM and Ultratech, Inc. Her experience in these organizations has allowed her to refine her skills and contribute to groundbreaking projects in the field of electrical engineering.

Collaborations

Marie-Claude has collaborated with several professionals in her field, including Timothy Harrison Daubenspeck and Wolfgang Sauter. These collaborations have further enriched her work and expanded her innovative capabilities.

Conclusion

Marie-Claude Paquet is a remarkable inventor whose contributions to connector technology have paved the way for advancements in electrical engineering. Her extensive patent portfolio and collaborative efforts highlight her dedication to innovation and excellence in her field.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: