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For the Inventor, By the Inventor

Burlington, CT, United States of America

Jeffrey Donald Gelorme

USPTO Granted Patents = 111 

 

Average Co-Inventor Count = 4.4

ph-index = 18

Forward Citations = 1,017(Granted Patents)

DiyaCoin DiyaCoin = 1.29 


Inventors with similar research interests:


Location History:

  • Both of Binghamton, NY (US) (1995)
  • Painville, CT (US) (1995)
  • Hartford, CT (US) (1995)
  • Binghamton, NY (US) (1986 - 1997)
  • Plainvill, CT (US) (1995 - 1998)
  • Plainville, CT (US) (1990 - 2008)
  • Yorktown Heights, NY (US) (2018)
  • Burlington, CT (US) (2006 - 2023)

Company Filing History:

goldMedal110 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal1 out of 5,671 
 
Globalfoundries Inc.
 patents

Years Active: 1986-2023

where 'Filed Patents' based on already Granted Patents

111 patents (USPTO):
1. 11574835 - Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding (2023-02-07),
2. 11424152 - Handler bonding and debonding for semiconductor dies (2022-08-23),
3. 11348833 - IR assisted fan-out wafer level packaging using silicon handler (2022-05-31),
4. 11172837 - Forming wearable stacked strain gauge sensor for monitoring (2021-11-16),
5. 11121005 - Handler bonding and debonding for semiconductor dies (2021-09-14),
6. 11094407 - Electronics miniaturization platform for medication verification and tracking (2021-08-17),
7. 10998217 - Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding (2021-05-04),
8. 10750615 - Method and apparatus for strain relieving surface mount attached connectors (2020-08-18),
9. 10679887 - Handler bonding and debonding for semiconductor dies (2020-06-09),
10. 10658182 - Chip handling and electronic component integration (2020-05-19),
11. 10651134 - Wafer level integration including design/co-design, structure process, equipment stress management and thermal management (2020-05-12),
12. 10651036 - Chip handling and electronic component integration (2020-05-12),
13. 10607963 - Chip package for two-phase cooling and assembly process thereof (2020-03-31),
14. 10586726 - Handler bonding and debonding for semiconductor dies (2020-03-10),
15. 10573538 - Handler bonding and debonding for semiconductor dies (2020-02-25),

Sure, I can help with that!

Title: The Innovative Journey of Jeffrey Donald Gelorme

Introduction:

Jeffrey Donald Gelorme, a prolific inventor based in Burlington, CT (US), has left a significant mark in the field of semiconductor technology. With an impressive portfolio of 111 patents to his name, Gelorme's groundbreaking work has revolutionized the industry.

Latest Patents:

Gelorme's latest patents showcase his expertise in developing cutting-edge solutions for semiconductor handling and packaging. One notable invention is the "Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding," which introduces a unique bonding material utilizing phenoxy resin and carbon black filler components. This material not only enhances bonding efficiency but also absorbs a substantial portion of infra-red (IR) wavelengths, improving the de-bonding process.

Another innovative patent is "Handler bonding and debonding for semiconductor dies," where Gelorme introduces a specialized release layer with electromagnetic radiation absorption properties. By incorporating additives like a 355 nm chemical absorber, this technology facilitates the efficient packaging and debonding of semiconductor devices, streamlining the manufacturing process.

Career Highlights:

Throughout his career, Gelorme has made significant contributions to leading companies in the industry, including IBM (International Business Machines Corporation) and Globalfoundries Inc. His expertise and innovative spirit have played a crucial role in driving technological advancements within these organizations, setting new standards for excellence in semiconductor research and development.

Collaborations:

Gelorme's collaborative efforts with esteemed colleagues like John Ulrich Knickerbocker and Bing Dang have further enriched his innovative endeavors. These partnerships have undoubtedly fostered a culture of creativity and excellence, leading to the successful realization of groundbreaking technologies in the semiconductor domain.

Conclusion:

In conclusion, Jeffrey Donald Gelorme's remarkable journey as an inventor stands as a testament to his pioneering spirit and unwavering dedication to pushing the boundaries of technological innovation. His inventive solutions continue to shape the future of semiconductor technology, inspiring generations of innovators to come.

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