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For the Inventor, By the Inventor

Burlington, CT, United States of America

Jeffrey Donald Gelorme

This inventor holds 111 USPTO granted patents and 6 published patent applications and 1 EPO patent, primarily in Semiconductor Packaging (CPC class H01L21-6835). Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1986-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jeffrey Donald Gelorme. Retrieved from https://idiyas.com/inventor/jeffrey-donald-gelorme

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 111 

% Patents Active = 87.4

 

Average Co-Inventor Count = 4.4

ph-index = 18

Forward Citations = 1,028(Granted Patents)

Forward Citations (Not Self Cited) = 992(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Both of Binghamton, NY (US) (1995)
  • Painville, CT (US) (1995)
  • Hartford, CT (US) (1995)
  • Binghamton, NY (US) (1986 - 1997)
  • Plainvill, CT (US) (1995 - 1998)
  • Plainville, CT (US) (1990 - 2008)
  • Yorktown Heights, NY (US) (2018)
  • Burlington, CT (US) (2006 - 2023)

Company Filing History:

goldMedal110 out of 166,351 
 
International Business Machines Corporation
 patents
silverMedal1 out of 5,671 
 
Globalfoundries Inc.
 patents

Years Active: 1986-2023

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Areas of Expertise:
Thermoplastic Adhesive
Wafer Bonding
Chip Handling
Strain Gauge Sensor
IR Assisted Packaging
Multi-Chip Module
Electrically Conductive Adhesive
Thermal Management
Medication Verification
Low Temperature Adhesives
Surface Mount Connectors
Electronics Miniaturization
111 patents (USPTO):Explore Patents
1. 11574835 - Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding (2023-02-07),
2. 11424152 - Handler bonding and debonding for semiconductor dies (2022-08-23),
3. 11348833 - IR assisted fan-out wafer level packaging using silicon handler (2022-05-31),
4. 11172837 - Forming wearable stacked strain gauge sensor for monitoring (2021-11-16),
5. 11121005 - Handler bonding and debonding for semiconductor dies (2021-09-14),
6. 11094407 - Electronics miniaturization platform for medication verification and tracking (2021-08-17),
7. 10998217 - Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding (2021-05-04),
8. 10750615 - Method and apparatus for strain relieving surface mount attached connectors (2020-08-18),
9. 10679887 - Handler bonding and debonding for semiconductor dies (2020-06-09),
10. 10658182 - Chip handling and electronic component integration (2020-05-19),
11. 10651134 - Wafer level integration including design/co-design, structure process, equipment stress management and thermal management (2020-05-12),
12. 10651036 - Chip handling and electronic component integration (2020-05-12),
13. 10607963 - Chip package for two-phase cooling and assembly process thereof (2020-03-31),
14. 10586726 - Handler bonding and debonding for semiconductor dies (2020-03-10),
15. 10573538 - Handler bonding and debonding for semiconductor dies (2020-02-25),

Sure, I can help with that!

Title: The Innovative Journey of Jeffrey Donald Gelorme

Introduction:

Jeffrey Donald Gelorme, a prolific inventor based in Burlington, CT (US), has left a significant mark in the field of semiconductor technology. With an impressive portfolio of 111 patents to his name, Gelorme's groundbreaking work has revolutionized the industry.

Latest Patents:

Gelorme's latest patents showcase his expertise in developing cutting-edge solutions for semiconductor handling and packaging. One notable invention is the "Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding," which introduces a unique bonding material utilizing phenoxy resin and carbon black filler components. This material not only enhances bonding efficiency but also absorbs a substantial portion of infra-red (IR) wavelengths, improving the de-bonding process.

Another innovative patent is "Handler bonding and debonding for semiconductor dies," where Gelorme introduces a specialized release layer with electromagnetic radiation absorption properties. By incorporating additives like a 355 nm chemical absorber, this technology facilitates the efficient packaging and debonding of semiconductor devices, streamlining the manufacturing process.

Career Highlights:

Throughout his career, Gelorme has made significant contributions to leading companies in the industry, including IBM (International Business Machines Corporation) and Globalfoundries Inc. His expertise and innovative spirit have played a crucial role in driving technological advancements within these organizations, setting new standards for excellence in semiconductor research and development.

Collaborations:

Gelorme's collaborative efforts with esteemed colleagues like John Ulrich Knickerbocker and Bing Dang have further enriched his innovative endeavors. These partnerships have undoubtedly fostered a culture of creativity and excellence, leading to the successful realization of groundbreaking technologies in the semiconductor domain.

Conclusion:

In conclusion, Jeffrey Donald Gelorme's remarkable journey as an inventor stands as a testament to his pioneering spirit and unwavering dedication to pushing the boundaries of technological innovation. His inventive solutions continue to shape the future of semiconductor technology, inspiring generations of innovators to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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