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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11574835 B1

PDFFull Text
Date of Patent:
Feb. 07, 2023

Filed:

Oct. 31, 2019

Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Bing Dang, Chappaqua, NY (US);

Jeffrey D. Gelorme, Burlington, CT (US);

John U. Knickerbocker, Yorktown Heights, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Tutunjian & Bitetto, P.C.

Samuel Waldbaum

Primary Examiner:

Jane L Stanley

Int. Cl.
CPC ...
H01L 21/683 (2006.01); C08G 59/06 (2006.01); C09J 163/00 (2006.01); C09J 171/00 (2006.01); C08L 63/00 (2006.01); C08L 71/00 (2006.01); H01L 21/02 (2006.01); C08K 3/04 (2006.01); C09J 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); C08G 59/063 (2013.01); C08K 3/04 (2013.01); C08L 63/00 (2013.01); C08L 71/00 (2013.01); C09J 9/00 (2013.01); C09J 163/00 (2013.01); C09J 171/00 (2013.01); H01L 21/02057 (2013.01); C08G 2650/56 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

Find Patent Forward Citations

Quick Actions:

Dang, Bing. (2023). Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding (U.S. Patent No. 11574835). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11574835

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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