The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2021
Filed:
Feb. 20, 2018
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Bing Dang, Chappaqua, NY (US);
Jeffrey D. Gelorme, Burlington, CT (US);
John U. Knickerbocker, Yorktown Heights, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/02 (2006.01); C08G 59/06 (2006.01); C09J 163/00 (2006.01); C09J 171/00 (2006.01); C08L 63/00 (2006.01); C08L 71/00 (2006.01); C08K 3/04 (2006.01); C09J 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); C08G 59/063 (2013.01); C08K 3/04 (2013.01); C08L 63/00 (2013.01); C08L 71/00 (2013.01); C09J 9/00 (2013.01); C09J 163/00 (2013.01); C09J 171/00 (2013.01); H01L 21/02057 (2013.01); C08G 2650/56 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.