The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Sep. 15, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Thomas J. Brunschwiler, Thalwil, CH;

Timothy Joseph Chainer, Putnam Valley, NY (US);

Evan George Colgan, Montvale, NJ (US);

Michael Anthony Gaynes, Vestal, NY (US);

Jeffrey Donald Gelorme, Burlington, CT (US);

Gerard McVicker, Stormville, NY (US);

Ozgur Ozsun, Kilchberg, CH;

Pritish Ranjan Parida, Fishkill, NY (US);

Mark Delorman Schultz, Ossining, NY (US);

Bucknell C. Webb, Ossining, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/473 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/4803 (2013.01); H01L 23/473 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 23/433 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83201 (2013.01);
Abstract

Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.


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