The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2020
Filed:
Aug. 25, 2019
International Business Machines Corporation, Armonk, NY (US);
Russell A. Budd, North Salem, NY (US);
Qianwen Chen, Ossining, NY (US);
Bing Dang, Chappaqua, NY (US);
Jeffrey D. Gelorme, Burlington, CT (US);
Li-wen Hung, Mahopac, NY (US);
John U. Knickerbocker, Yorktown Heights, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.