Hopewell Junction, NY, United States of America

David L Questad

This inventor holds 68 USPTO granted patents and 1 EPO patent, primarily in Electronic Packaging (CPC class H01L). Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1999-2020.

USPTO Granted Patents = 68

% Patents Active = 47.1

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 5.5

ph-index = 9

Forward Citations = 300(Granted Patents)

Forward Citations (Not Self Cited) = 281(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hopewell Junction, VT (US) (2007)
Vestal, NY (US) (1999 - 2008)
Armonk, NY (US) (2013)
Hopewell Junction, NY (US) (2005 - 2020)

Company Filing History:

67 out of 166,159

International Business Machines Corporation

Years Active: 1999-2020

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Areas of Expertise:

Solder Interconnects

Stacked Vias

Laminate Test Structures

Heat Sink Attachment

Chip Warping

Dielectric Cracking

Electronic Substrates

Flip Chip Package

Non-Wettable Sidewalls

Vertical Stiffness Control

Lead-Free Reliability

Trenched Substrates

68 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10750615 - Method and apparatus for strain relieving surface mount attached connectors (2020-08-18),

2. 10699972 - Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity (2020-06-30),

3. 10381276 - Test cell for laminate and method (2019-08-13),

4. 10368441 - Method and apparatus for strain relieving surface mount attached connectors (2019-07-30),

5. 10342160 - Heat sink attachment on existing heat sinks (2019-07-02),

6. 10249548 - Test cell for laminate and method (2019-04-02),

7. 10014273 - Fixture to constrain laminate and method of assembly (2018-07-03),

8. 9974179 - Method and apparatus for strain relieving surface mount attached connectors (2018-05-15),

9. 9899279 - Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity (2018-02-20),

10. 9883612 - Heat sink attachment on existing heat sinks (2018-01-30),

11. 9627784 - Method and apparatus for strain relieving surface mount attached connectors (2017-04-18),

12. 9508789 - Electronic components on trenched substrates and method of forming same (2016-11-29),

13. 9455234 - Fixture to constrain laminate and method of assembly (2016-09-27),

14. 9099458 - Construction of reliable stacked via in electronic substrates—vertical stiffness control method (2015-08-04),

15. 9018760 - Solder interconnect with non-wettable sidewall pillars and methods of manufacture (2015-04-28),

Title: The Inventive Mind of David L Questad

Introduction: David L Questad, a talented inventor hailing from Hopewell Junction, NY, has made significant contributions to the world of innovation with his creative and groundbreaking ideas.

Latest Patents: David L Questad's latest patents showcase his ingenuity and forward-thinking approach to problem-solving. His most recent inventions have been recognized for their unique concepts and practical applications in various industries.

Career Highlights: Throughout his illustrious career, David L Questad has demonstrated a remarkable ability to transform innovative ideas into tangible inventions. His passion for creating solutions to complex challenges has led to the development of numerous groundbreaking technologies.

Collaborations: David L Questad has collaborated with leading experts and professionals in the field of innovation to bring his ideas to life. His partnerships with like-minded individuals have resulted in successful projects that have had a lasting impact on the industry.

Conclusion: David L Questad's dedication to innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His remarkable achievements continue to inspire aspiring inventors and shape the future of technology.