The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2020

Filed:

Nov. 30, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

William E. Bernier, Endwell, NY (US);

Timothy H. Daubenspeck, Colchester, VT (US);

Virendra R. Jadhav, Wappingers Falls, NY (US);

Valerie A. Oberson, Quebec, CA;

David L. Questad, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); B65D 1/36 (2006.01); G01N 3/60 (2006.01); G01N 19/04 (2006.01); B05D 1/36 (2006.01); G01N 25/16 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/30 (2013.01); B05D 1/36 (2013.01); G01N 25/16 (2013.01); G01N 3/60 (2013.01); G01N 19/04 (2013.01); G01N 2203/0296 (2013.01); G01N 2203/0298 (2013.01); H01L 24/13 (2013.01); H01L 2224/131 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/351 (2013.01);
Abstract

A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a flat laminate structure. The method of using the test structure includes isolating a cause of a multivariable chip join problem that is adversely impacted by warpage and quantifying a contribution of the warpage, itself, in a formation of the multivariable chip join problem.


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