= 0.96 Inventors with similar research interests:
Location History:
- Coldchester, VT (US) (2013)
- Essex Junction, VT (US) (2012 - 2015)
- Colchester, VT (US) (1989 - 2020)
Company Filing History:
150 out of 164,108 
14 out of 5,671 
3 out of 135 
Years Active: 1989-2020
Title: Timothy Harrison Daubenspeck: A Pioneer in Innovations and Patents
Introduction:
In the ever-evolving world of innovations and patents, Timothy Harrison Daubenspeck has made a significant name for himself. With numerous patents to his credit and a remarkable career in renowned companies, Daubenspeck's contributions have played a vital role in advancing technology. Let's delve into his latest patents, career highlights, collaborations, and conclude with an appreciation of his remarkable achievements.
Latest Patents:
Daubenspeck's recent patents exemplify his ingenuity and problem-solving skills. One noteworthy invention is the "Flat Laminate, Symmetrical Test Structures, and Method of Use to Gauge White Bump Sensitivity." This symmetrical and flat laminate structure acts as a testing platform to evaluate white bump sensitivity caused by CTE mismatch. It effectively isolates and quantifies the impact of warpage on multivariable chip join problems.
Furthermore, he has also pioneered the development of "Extrusion-Resistant Solder Interconnect Structures and Methods of Forming." These structures and methods enhance the reliability of interconnects, including a controlled collapse chip connection (C4) bump, a solder layer, and an underfill layer to minimize various failure mechanisms and increase overall performance.
Career Highlights:
Throughout his illustrious career, Daubenspeck has been associated with esteemed companies, including IBM and GlobalFoundries Inc. (formerly "GLOBALFOUNDRIES"). His expertise and diligence have contributed immensely to these organizations' success and technological advancements.
At IBM, Daubenspeck worked on cutting-edge projects, leveraging his skills in designing innovative solutions. His groundbreaking inventions have significantly impacted the semiconductor industry, setting new benchmarks in interconnect technologies.
Collaborations:
Daubenspeck's accomplishments were not achieved in isolation. The collaborative efforts with his esteemed coworkers and colleagues have added depth and breadth to his accomplishments. Two notable coworkers include Wolfgang Sauter and Jeffrey P Gambino, who have worked alongside Daubenspeck to push the boundaries of technological advancements.
Together, they have embarked on projects that have revolutionized interconnect structures, test methodologies, and improved overall chip reliability, ensuring the seamless integration of breakthrough innovations into real-world applications.
Conclusion:
Timothy Harrison Daubenspeck has proven himself as a true visionary in the realm of innovations and patents. With a staggering 166 patents to his name, his contributions in the areas of interconnect technologies and chip reliability have reshaped the semiconductor landscape.
By establishing invaluable collaborations and working with esteemed companies like IBM and GlobalFoundries Inc., Daubenspeck has solidified his position as a pioneer in the industry. As technology continues to evolve, we eagerly await more groundbreaking inventions from this brilliant mind, as he continues to leave an indelible mark on the world of innovations and patents.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.